Byoung‐Gue Min - Concepedia

Author

Byoung‐Gue Min

Electronics and Telecommunications Research Institute ORCID

Also Known As

B. -G. Min, B. G. Min, B. Min, B.-G Min, B.-G. Min, B.G Min, B.G. Min, B.‐G. Min, Byoung-Gue Min, Byoung-gue Min

Publications

838

Citations

H-Index

Concepts

All Affiliations

Electronics and Telecommunications Research Institute CSIRO Manufacturing Monash University Kumoh National Institute of Technology Agency for Defense Development

About

Byoung‐Gue Min is an author at Electronics and Telecommunications Research Institute specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	18	673
2	Applied Physics	8	8	185
3	Chemistry	5	5	261
4	Chemical Engineering	4	4	229
5	Natural Sciences	1	1	11

Byoung‐Gue Min

Publications

703

Citations

H-Index

Page 1

	Year	Citations
Quantitative analysis of the cure reaction of DGEBA/DDS epoxy resins without and with thermoplastic polysulfone modifier using near infra-red spectroscopy Byoung‐Gue Min, Z. H. Stachurski, J. H. Hodgkin, Polymer Materials ScienceChemical EngineeringThermoplastic Polysulfone ModifierEngineeringPolymer Science	1993	107
Reaction mechanisms, microstructure, and fracture properties of thermoplastic polysulfone‐modified epoxy resin Byoung‐Gue Min, J. H. Hodgkin, Z. H. Stachurski Journal of Applied Polymer Science EngineeringEpoxy NetworkMechanical EngineeringChemistryReaction Mechanisms	1993	95
Cure kinetics of elementary reactions of a DGEBA/DDS epoxy resin: 1. Glass transition temperature versus conversion Byoung‐Gue Min, Z. H. Stachurski, J. H. Hodgkin Polymer Materials ScienceChemical EngineeringEngineeringElementary ReactionsCure Kinetics	1993	57
Microstructural effects and the toughening of thermoplastic modified epoxy resins Byoung‐Gue Min, Z. H. Stachurski, J. H. Hodgkin Journal of Applied Polymer Science EngineeringMechanical EngineeringChemistryThermoplastic CompositeEpoxy Resins	1993	55
Cure kinetics of elementary reactions of a diglycidyl ether of bisphenol A/diaminodiphenylsulfone epoxy resin: 2. Conversion versus time Byoung‐Gue Min, Z. H. Stachurski, J. H. Hodgkin Polymer Chemical EngineeringPolymer ReactionEngineeringElementary ReactionsCure Kinetics	1993	54
300mm FinFET results utilizing conformal, damage free, ultra shallow junctions (X<inf>j</inf>&#x223C;5nm) formed with molecular monolayer doping technique K.-W. Ang, Joel Barnett, W.Y. Loh, Materials ScienceSemiconductor TechnologyElectrical EngineeringEngineeringCrystalline Defects	2011	46
The dependence of fracture properties on cure temperature in a DGEBA/DDS epoxy system Byoung‐Gue Min, J. H. Hodgkin, Z. H. Stachurski Journal of Applied Polymer Science EngineeringMechanical EngineeringGlass MaterialChemistryPolymers	1993	46
High performance 32nm SOI CMOS with high-k/metal gate and 0.149µm 2 SRAM and ultra low-k back end with eleven levels of copper B. Greene, Qingqing Liang, K. Amarnath, Symposium on VLSI Technology EngineeringVlsi DesignNm Ground RulesHigh Performance 32NmIntegrated Circuits	2006	40
Microwave Low-Noise Performance of $0.17~\mu \text{m}$ Gate-Length AlGaN/GaN HEMTs on SiC With Wide Head Double-Deck T-Shaped Gate Hyung Sup Yoon, Byoung‐Gue Min, Jong Min Lee, IEEE Electron Device Letters Maximum Extrinsic TransconductanceWide-bandgap SemiconductorElectrical EngineeringEngineeringMicrowave Low-noise Performance	2016	28
Depression of glass transition temperature due to the chain extension in glassy state S.C. Lee, Byoung‐Gue Min Polymer Materials ScienceEngineeringPhysicsGlass TransitionOptical Properties	1999	26

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