Concepedia

Peter Haswell

PH

4

Publications

130

Citations

4

H-Index

2003

Active since

Affiliations

University of Maryland, College Park(Current)

Peter Haswell is an author at University of Maryland, College Park specializing in engineering, materials science, and microstructure.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingMaterials EngineeringMechanical EngineeringMechanics Of MaterialsCorrosionApplied PhysicsSolid Mechanics

Publications per year

2003–2005

4

Publications

4

Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloy

Qian Zhang, Abhijit Dasgupta, Peter Haswell · 2004 · 59 citations

Materials Science, Viscoplastic Constitutive Properties, Engineering +7

Partitioned viscoplastic-constitutive properties of the Pb-free Sn3.9Ag0.6Cu solder

Qian Zhang, Abhijit Dasgupta, Peter Haswell · Journal of Electronic Materials · 2004 · 41 citations

Materials Engineering, Materials Science, Engineering +6

Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

Qian Zhang, Abhijit Dasgupta, Peter Haswell · Journal of Electronic Packaging · 2005 · 19 citations

Engineering, Mechanical Engineering, Damage Metrics +18

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders

Qian Zhang, Abhijit Dasgupta, Peter Haswell · 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 · 2003 · 11 citations

Materials Science, Materials Engineering, Sn3.9ag0.6cu Pb-free Solder +12

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