Statistics
Publications
3
Citations
102
H-Index
3
Active since
2003
Affiliations
Ni Tan is an author at Tsinghua University specializing in mechanics of materials, materials science, and mechanical engineering.
Publications per year
2003–2022
3
3
The Strength of the Silicon Die in Flip-Chip Assemblies
B. Cotterell, Zhong Chen, Jiangbo Han et al. · Journal of Electronic Packaging · 2003 · 61 citations
Rows per page
1–3 of 3