Concepedia

Gong‐Peng Cui

GC

3

Publications

92

Citations

3

H-Index

2023

Active since

Affiliations

Qingdao University of Technology(Current)

Chinese Academy of Sciences

Qingdao University of Science and Technology

Gong‐Peng Cui is an author at Qingdao University of Technology specializing in thermal management, thermal engineering, and flexible electronics.

Top concepts

Publications per year

2023–2024

3

Publications

3

3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management

Chang‐Ping Feng, Kai-Yin Sun, Jin‐Chao Ji et al. · Additive manufacturing · 2023 · 50 citations

, , +11

3D-printed Bi<sub>2</sub>Te<sub>3</sub>-based Thermoelectric Generators for Energy Harvesting and Temperature Response

Gong‐Peng Cui, Chang‐Ping Feng, Shao-Cun Xu et al. · ACS Applied Materials & Interfaces · 2024 · 27 citations

Flexible phase change materials for overheating protection of electronics

Chang‐Ping Feng, Kai-Yin Sun, Jin‐Chao Ji et al. · Journal of Energy Storage · 2024 · 15 citations

, , +9

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