Tadahiko Hanada

Fabrication and Reliability Demonstration of 3 µm Diameter Photo Vias at 15 µm Pitch in Thin Photosensitive Dielectric Dry Film for 2.5 D Glass Interposer Applications

Daichi Okamoto, Yoko Shibasaki, Daisuke Shibata et al. · 2019 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16

An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages

Daichi Okamoto, Yoko Shibasaki, Daisuke Shibata et al. · 2018 · 11 citations

Engineering, Electrical Engineering, Materials Engineering +14

An Optical Add-Drop Multiplexer with a Grating-Loaded Directional Coupler in silica Waveguides

Naoki Ofusa, Takashi Saitō, T. Shimoda et al. · IEICE Transactions on Communications · 1999 · 10 citations

Engineering, Electrical Engineering, Materials Science +16

Photosensitivity in silica-based waveguides deposited by atmospheric pressure chemical vapor deposition

Takashi Saitō, Tadahiko Hanada, N. Kitamura et al. · Applied Optics · 1998 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +17

Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack Resistance at TST for Automotive IC Package

Chiho Ueta, Kazuya Okada, Toko Shiina et al. · 2017 · 10 citations

Engineering, Electrical Engineering, Materials Engineering +17