I. Ubero-Martínez

A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

J. Vallepuga-Espinosa, I. Ubero-Martínez, Luis Rodríguez‐Tembleque et al. · Engineering Analysis with Boundary Elements · 2020 · 19 citations

Materials Science, Microelectronic Packaging, Engineering +15

Non-linear interface thermal conditions in three-dimensional thermoelastic contact problems

I. Ubero-Martínez, Luis Rodríguez‐Tembleque, J. Cifuentes-Rodríguez et al. · Computers & Structures · 2020 · 12 citations

Engineering, Mechanics, Contact Mechanic +8

3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions

I. Ubero-Martínez, Luis Rodríguez‐Tembleque, J. Cifuentes-Rodríguez et al. · International Journal for Numerical Methods in Engineering · 2022 · 11 citations · Full text

The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems

I. Ubero-Martínez, J. Vallepuga-Espinosa, Luis Rodríguez‐Tembleque et al. · Engineering Analysis with Boundary Elements · 2019 · 10 citations

Engineering, Mechanical Engineering, Interstitial Regions +17