Concepedia
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Publications
1
Citations
21
H-Index
Active since
1996
A. Lee is an author specializing in electronic packaging, thermal engineering, and engineering.
Top concepts
EngineeringHeat TransferThermodynamicsThermal ModelingThermal EngineeringComputer EngineeringElectronic PackagingElectrical Engineering
Publications per year
1996–1996
Thermal modeling of electrical contacts in switches and relays
C.H. Leung, A. Lee, Bor-Jenq Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 21 citations
Electrical Engineering, Engineering, Thermal Analysis Program +12
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