Noriyuki Yamachika

Evidence for “superfilling” of submicrometer trenches with electroless copper deposit

Madoka Hasegawa, Noriyuki Yamachika, Yosi Shacham‐Diamand et al. · Applied Physics Letters · 2007 · 39 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Effect of Carbon Content on the Electrical Resistivity of Electrodeposited Copper

Tetsuya Ōsaka, Noriyuki Yamachika, Masahiro Yoshino et al. · Electrochemical and Solid-State Letters · 2009 · 27 citations

Electrodeposited Copper, Engineering, Electrode-electrolyte Interface +18

Electrodeposition of amorphous Au–Ni alloy film

Noriyuki Yamachika, Yuta Musha, Junji Sasano et al. · Electrochimica Acta · 2008 · 17 citations

Materials Science, Materials Engineering, Engineering +3

An Electrochemical Investigation of Additive Effect in Trench-Filling of ULSI Interconnects by Electroless Copper Deposition

Madoka Hasegawa, Noriyuki Yamachika, Y. Okinaka et al. · Electrochemistry · 2007 · 15 citations · Full text

Engineering, Electrode-electrolyte Interface, Interconnect (Integrated Circuits) +20