Concepedia

Bob Sykes

BS

Statistics

Publications

5

Citations

206

H-Index

5

Active since

2007

Affiliations

Hong Kong University of Science and Technology(Current)

Oracle (United States)

Bob Sykes is an author at Hong Kong University of Science and Technology specializing in materials science, mechanics of materials, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsMechanicsMicrostructureSolid MechanicsHeat TransferFailure Analysis

Publications per year

2007–2011

5

Publications

5

High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 73 citations

Brittle Fractures, Engineering, Mechanical Engineering +19

Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 72 citations

Materials Science, Engineering, Snpb Solder Balls +13

Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 28 citations

Materials Science, Engineering, Durability Performance +14

Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 23 citations

Engineering, Fracture Energy, Mechanical Engineering +16

Improved testing of soldered Busbar interconnects on silicon solar cells

Robert Klengel, Matthias Petzold, Dirk Schade et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2011 · 10 citations

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