Concepedia

Alexander Frick

AF

Statistics

Publications

2

Citations

24

H-Index

2

Active since

2020

Alexander Frick is an author specializing in three-dimensional integration, wafer bonding, and flip-chip bonding.

Publications per year

2020–2020

2

Publications

2

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

Matthias Fettke, Timo Kubsch, Andrej Kolbasow et al. · 2020 · 13 citations

Engineering, Materials Engineering, Materials Science +14

A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Matthias Fettke, Andrej Kolbasow, Vinith Bejugam et al. · 2020 · 11 citations

Engineering, Electrical Engineering, Materials Science +17

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