P.J. Rudnik

High rate reactive sputtering in an opposed cathode closed-field unbalanced magnetron sputtering system

William D. Sproul, P.J. Rudnik, Michael E. Graham et al. · Surface and Coatings Technology · 1990 · 105 citations

Electrical Engineering, Engineering, Magnetohydrodynamics

The effect of N2 partial pressure, deposition rate and substrate bias potential on the hardness and texture of reactively sputtered TiN coatings

W.D. Sproul, P.J. Rudnik, Michael E. Graham · Surface and Coatings Technology · 1989 · 78 citations

Materials Science, Materials Engineering, Engineering +11

Advances in partial-pressure control applied to reactive sputtering

W.D. Sproul, P.J. Rudnik, C. A. Gogol et al. · Surface and Coatings Technology · 1989 · 72 citations

Engineering, Target Fabrication, Numerical Simulation +4

The effect of target power on the nitrogen partial pressure level and hardness of reactively sputtered titanium nitride coatings

William D. Sproul, P.J. Rudnik, C. A. Gogol · Thin Solid Films · 1989 · 68 citations

Materials Science, Materials Engineering, Thermal Spray Coating +8

Reactive unbalanced magnetron sputtering of the nitrides of Ti, Zr, Hf, Cr, Mo, Ti-Al, Ti-Zr and Ti-Al-V

William D. Sproul, Michael E. Graham, Ming-Show Wong et al. · Surface and Coatings Technology · 1993 · 57 citations

Materials Science, Magnetism, Spintronics +10