Felipe Cemin

Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films

Felipe Cemin, G. Abadias, Tiberiu Minea et al. · Acta Materialia · 2017 · 77 citations

Materials Science, Epitaxial Growth, Engineering +9

The influence of different silicon adhesion interlayers on the tribological behavior of DLC thin films deposited on steel by EC-PECVD

Felipe Cemin, L. T. Bim, C. M. Menezes et al. · Surface and Coatings Technology · 2015 · 62 citations

On the understanding of the silicon-containing adhesion interlayer in DLC deposited on steel

Felipe Cemin, Carla D. Boeira, Carlos A. Figueroa · Tribology International · 2015 · 59 citations

Materials Science, Engineering, Adhesive Material +6

Tuning high power impulse magnetron sputtering discharge and substrate bias conditions to reduce the intrinsic stress of TiN thin films

Felipe Cemin, G. Abadias, Tiberiu Minea et al. · Thin Solid Films · 2019 · 57 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +14

Low electrical resistivity in thin and ultrathin copper layers grown by high power impulse magnetron sputtering

Felipe Cemin, Daniel Lundin, D. Cammilleri et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2016 · 54 citations

Hipims Cu Films, Hipims Discharge, Engineering +22