Concepedia

Y. Wang

YW

1

Publications

42

Citations

1

H-Index

2017

Active since

Affiliations

University of Michigan–Dearborn(Current)

Y. Wang is an author at University of Michigan–Dearborn specializing in mechanical engineering, materials science, and electronic packaging.

Top concepts

EngineeringHeat TransferFailure AnalysisMaterial ScienceThermal EngineeringElectronic PackagingMaterials EngineeringMechanical Engineering

Publications per year

2017–2017

1

Publications

1

Failure analysis of fine-lamellar structured YSZ based thermal barrier coatings with submicro/nano-grains

Y. Wang, Yu Bai, Tao Yuan et al. · Surface and Coatings Technology · 2017 · 42 citations

Materials Science, Materials Engineering, Thermal Spray Coating +11

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