Concepedia

Ben Nagaraj

BN

Statistics

Publications

2

Citations

31

H-Index

2

Active since

1998

Affiliations

Motorola (United States)(Current)

Ben Nagaraj is an author at Motorola (United States) specializing in engineering, packaging engineering, and chip packaging.

Publications per year

1998–2000

2

Publications

2

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

Ben Nagaraj, M. Mahalingam · Journal of Electronic Packaging · 1998 · 20 citations

, , +16

Applications of DSP to Explicit Dynamic FEA Simulations of Elastically‐Dominated Impact Problems

Ted Diehl, Doug Carroll, Ben Nagaraj · Shock and Vibration · 2000 · 11 citations · Full text

, , +17

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