Concepedia

Kun Ba

KB

19

Publications

1K

Citations

17

H-Index

2012

Active since

Affiliations

Fudan University(Current)

Shanghai Fudan Microelectronics (China)

State Key Laboratory of ASIC and System

Shanghai Institute of Technical Physics

ShangHai JiAi Genetics & IVF Institute

Kun Ba is an author at Fudan University specializing in engineering, materials science, and chemistry.

ORCID

Top concepts

Publications per year

2012–2023

19

Publications

19

Epitaxial Growth and Integration of Insulating Metal–Organic Frameworks in Electrochemistry

Anqi Hu, Qingqing Pang, Can Tang et al. · Journal of the American Chemical Society · 2019 · 126 citations

Chemical and Bandgap Engineering in Monolayer Hexagonal Boron Nitride

Kun Ba, Wei Jiang, Jingxin Cheng et al. · Scientific Reports · 2017 · 112 citations · Full text

Single Faceted Two-Dimensional Mo<sub>2</sub>C Electrocatalyst for Highly Efficient Nitrogen Fixation

Kun Ba, Ganlin Wang, Tong Ye et al. · ACS Catalysis · 2020 · 112 citations

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Metal–Organic Framework for Transparent Electronics

Jie Wu, Jinhang Chen, Chao Wang et al. · Advanced Science · 2020 · 89 citations · Full text

Single-Atom Electroplating on Two Dimensional Materials

Ningning Xuan, Jinhang Chen, Jianjian Shi et al. · Chemistry of Materials · 2018 · 83 citations

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