Gyeo-Re Lee

Angular dependence of SiO2 etching in a fluorocarbon plasma

Byeong‐Ok Cho, Sung‐Wook Hwang, Gyeo-Re Lee et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2000 · 57 citations

Materials Science, Fluorocarbon Plasma, Plasma Electronics +13

Redeposition of etch products on sidewalls during SiO2 etching in a fluorocarbon plasma. I. Effect of particle emission from the bottom surface in a CF4 plasma

Jae-Ho Min, Sung‐Wook Hwang, Gyeo-Re Lee et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2002 · 34 citations

Materials Engineering, Materials Science, Chemical Engineering +14

Angular dependence of Si3N4 etch rates and the etch selectivity of SiO2 to Si3N4 at different bias voltages in a high-density C4F8 plasma

Jin-Kwan Lee, Gyeo-Re Lee, Jae-Ho Min et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2007 · 29 citations

Electrical Engineering, Ion Implantation, Engineering +14

Angular dependence of SiO2 etch rate at various bias voltages in a high density CHF3 plasma

Gyeo-Re Lee, Sung‐Wook Hwang, Jae-Ho Min et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2002 · 25 citations

Electrical Engineering, Plasma Electronics, Engineering +15

Angular dependence of the redeposition rates during SiO2 etching in a CF4 plasma

Byeong‐Ok Cho, Sung‐Wook Hwang, Gyeo-Re Lee et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2001 · 24 citations

Plasma Electronics, Engineering, Physics +14