Juan C. Madeni

Database for Solder Properties with Emphasis on New Lead-free Solders

David R. Smith, Thomas A. Siewert, L Stephen et al. · 2002 · 178 citations

Solder Properties, Business Intelligence

Spreading and solidification behavior of nickel wide-gap brazes

Scott D. Nelson, Stephen Liu, Srikanth Kottilingam et al. · Welding in the World · 2014 · 17 citations

Materials Science, Materials Engineering, Engineering +7

Formation and Growth of Intermetallics at the Interface Between Lead-Free Solders and Copper Substrates

Thomas A. Siewert, Juan C. Madeni, S X. Liu · 2003 · 15 citations

Engineering, Corrosion, Electronic Packaging +19

Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds

Juan C. Madeni, S. Liu · Soldagem & Inspeção · 2011 · 14 citations · Full text

Interfacial Reactions, Engineering, Mechanical Engineering +17