Yanxia Huo

A model for nanogrinding based on direct evidence of ground chips of silicon wafers

Zhenyu Zhang, Yanxia Huo, Dongming Guo · Science China Technological Sciences · 2013 · 116 citations

Electrical Engineering, Silicon Wafers, Engineering +14

High-speed dicing of silicon wafers conducted using ultrathin blades

Hongxiu Zhou, Shuo Qiu, Yanxia Huo et al. · The International Journal of Advanced Manufacturing Technology · 2012 · 29 citations

Wafer Scale Processing, Engineering, Microfabrication +7

Deformation twinning evolution from a single crystal in a face-centered-cubic ternary alloy

Zhenyu Zhang, Yang Song, Dongming Guo et al. · Scientific Reports · 2015 · 23 citations · Full text

Ultrahigh hardness and synergistic mechanism of a nanotwinned structure of cadmium zinc telluride

Zhenyu Zhang, Yanxia Huo, Fengwei Huo et al. · Scripta Materialia · 2013 · 21 citations

Materials Science, Materials Engineering, Engineering +10

Hardening mechanism of twin boundaries during nanoindentation of soft-brittle CdTe crystals

Zhenyu Zhang, Xianzhong Zhang, Xiaoguang Guo et al. · Scripta Materialia · 2013 · 13 citations

Materials Science, Twin Boundaries, Engineering +10