Area effect on electric breakdown of copper and stainless steel electrodes in vacuum

M. Okawa, T. Shioiri, H. Ōkubo, +1

IEEE Transactions on Electrical Insulation

Electrical EngineeringElectromigration TechniqueEngineeringHigh Voltage EngineeringCorrosion +11

Influence of electrode area on the conditioning effect in vacuum

T. Shioiri, R. Kamikawaji, E. Kaneko, +3

IEEE Transactions on Dielectrics and Electrical Insulation

Different Surface AreasElectrical EngineeringDielectricsEngineeringElectromigration Technique +11

Impulse Voltage Field Emission Characteristics and Breakdown Dependency Upon Field Strength in Vacuum Gaps

T. Shioiri, I. Ohshima, Masaki Honda, +3

IEEE Transactions on Power Apparatus and Systems

Electrical EngineeringHigh Voltage ImpulsesEngineeringVacuum GapsGlow Discharge +5

New technology for medium voltage solid insulated switchgear

Junichi Sato, Osamu Sakaguchi, Nobutaka Kubota, +7

IEEE PES Transmission and Distribution Conference and Exhibition

Electrical EngineeringEngineeringNew TechnologyHigh Voltage EngineeringPower Device +6

Insulation characteristics of vacuum interrupter for a new 72/84 kV C-GIS

T. Shioiri, M. Honma, Mizuki Miyagawa, +2

IEEE Transactions on Dielectrics and Electrical Insulation

Insulation CharacteristicsElectrical EngineeringEngineeringHigh Voltage EngineeringVacuum Interrupter +7

Dielectric breakdown probabilities for uniform field gap in vacuum

T. Shioiri, T. Kamikawaji, K. Yokokura, +3

Electrical EngineeringReliability EngineeringEngineeringPhysicsDielectric Breakdown Probabilities +10

Investigation of dielectric breakdown probability distribution for double-break vacuum circuit breaker

T. Shioiri, Y. Niwa, T. Kamikawaji, +1

Electrical EngineeringReliability EngineeringEngineeringHardware ReliabilityLow Voltage +7

Effect of Dielectric Materoals on Surface Breakdown in Vacuum and Analysis by Electron Trajectory Simulation

H. Takahashi, T. Shioiri, Koji Matsumoto

IEEE Transactions on Electrical Insulation

EngineeringGlow DischargeElectron Trajectory SimulationDielectric MateroalsVacuum Device +16

Generation of microparticles from copper-chromium contacts in vacuum

T. Kamikawaji, T. Shioiri, T. Funahashi, +3

IEEE Transactions on Power Delivery

EngineeringMetal NanoparticlesMechanical EngineeringMicromanufacturingVacuum Device +19

Breakdown Characteristics under Metallic Particle Contaminated Conditions in Vacuum Gap

T. Shioiri, T. Kamikawaji, Kazuhiro Matsuo, +3

IEEJ Transactions on Power and Energy

Metallic ParticlesElectrical EngineeringEngineeringElectrodes MaterialPhysics +10