Concepedia
Statistics
Publications
4
Citations
594
H-Index
Active since
2018
Affiliations
University of Coimbra(Current)
Institute for Systems Engineering and Computers
Carnegie Mellon University
Hugo Paisana is an author at University of Coimbra specializing in advanced packaging, thin films, and electronic packaging.
Top concepts
Thin Films3D PrintingEngineeringApplied PhysicsNanofabricationMaterial ScienceMicrofabricationAdvanced PackagingElectronic DevicesSurface Technology
Publications per year
2018–2020
EGaIn‐Assisted Room‐Temperature Sintering of Silver Nanoparticles for Stretchable, Inkjet‐Printed, Thin‐Film Electronics
Mahmoud Tavakoli, Mohammad H. Malakooti, Hugo Paisana et al. · Advanced Materials · 2018 · 305 citations
Hydroprinted Electronics: Ultrathin Stretchable Ag–In–Ga E-Skin for Bioelectronics and Human–Machine Interaction
Pedro Alhais Lopes, Hugo Paisana, Anı́bal T. de Almeida et al. · ACS Applied Materials & Interfaces · 2018 · 138 citations
Fully Untethered Battery-free Biomonitoring Electronic Tattoo with Wireless Energy Harvesting
José Alberto, Cristina Leal, Cláudio Roberto Alves Fernandes et al. · Scientific Reports · 2020 · 87 citations · Full text
High Resolution Soft and Stretchable Circuits with PVA/Liquid‐Metal Mediated Printing
André F. Silva, Hugo Paisana, Tânia Fernandes et al. · Advanced Materials Technologies · 2020 · 64 citations
Engineering, Thin Film Process Technology, Surface Technology +19
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