Hyouk Lee

Publications

Citations

H-Index

1996

Active since

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Hyouk Lee is an author at Korea Advanced Institute of Science and Technology specializing in electronic packaging, plasticity, and fracture mechanics.

Top concepts

PlasticityEngineeringSolid MechanicsMaterial ScienceFracture MechanicsMechanical BehaviorElectronic PackagingStructural MechanicsMechanical EngineeringMechanics Of Materials

Publications per year

1996–1996

Publications

A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks

Hyouk Lee, Youn Young Earmme · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 43 citations

Package Crack, Engineering, Mechanical Engineering +19

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