Shi‐Chang Tseng

Publications

221

Citations

H-Index

1994

Active since

Affiliations

National Yunlin University of Science and Technology(Current)

University of Wisconsin–Madison

TransWorld University

Shi‐Chang Tseng is an author at National Yunlin University of Science and Technology specializing in engineering, materials science, and mechanical engineering.

ORCID

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMechanics Of MaterialsSensorsSensor DesignOptical SensorsSolid MechanicsSensor TechnologyFlexible Electronics

Publications per year

1994–2018

Publications

Electroless silver plating on tetraethoxy silane-bridged fiber glass

Wan‐Fu Lien, Po‐Chen Huang, Shi‐Chang Tseng et al. · Applied Surface Science · 2011 · 39 citations

Materials Science, Engineering, Electroless Silver +3

A study of integration of LIGA and M-EDM technology on the microinjection molding of ink-jet printers’ nozzle plates

Shi‐Chang Tseng, Yi-Chern Chen, Chia-Lung Kuo et al. · Microsystem Technologies · 2005 · 29 citations

M-edm Technology, Engineering, Mechanical Engineering +6

Prediction of Shrinkage and Warpage of Fiber Reinforced Thermoset Composite Parts

Shi‐Chang Tseng, Tim A. Osswald · Journal of Reinforced Plastics and Composites · 1994 · 28 citations

Materials Science, Fibre-reinforced Plastic, Engineering +12

Research of Non-Ideal Effect and Dynamic Measurement of the Flexible-Arrayed Chlorine Ion Sensor

Shi‐Chang Tseng, Tong-Yu Wu, Jung-Chuan Chou et al. · IEEE Sensors Journal · 2016 · 23 citations

Engineering, M Sodium Chloride, Radio Frequency +22

Core deflection in injection molding

A. Jeffrey Giacomin, Aaron J. Hade, Leighta M. Johnson et al. · Journal of Non-Newtonian Fluid Mechanics · 2011 · 22 citations

Injection Molding, Engineering, Mechanics +6

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