Statistics
Publications
2
Citations
27
H-Index
2
Active since
2004
J. Medding is an author specializing in wafer bonding, materials science, and chip packaging.
Publications per year
2004–2004
2
2
J. Medding, Roland Stalder, M. Niederhauser et al. · 2004 · 17 citations
Natural Sciences, Materials Science, Electronic Materials +14
1–2 of 2