Concepedia

L Wang

LW

1

Publications

65

Citations

1

H-Index

2006

Active since

L Wang is an author specializing in thermal modeling, solid mechanics, and thermodynamics.

Top concepts

EngineeringHeat TransferThermodynamicsSolid MechanicsMicroelectronicsThermal ModelingAdvanced PackagingThermal EngineeringElectronic PackagingNumerical Simulation

Publications per year

2006–2006

1

Publications

1

Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device

J. B. Chang, L Wang, J Dirk et al. · Welding Journal · 2006 · 65 citations

Engineering, Mechanical Engineering, Chip Temperature +25

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