Concepedia

Timo Schreck

TS

4

Publications

68

Citations

4

H-Index

2012

Active since

Affiliations

Aschaffenburg University of Applied Sciences(Current)

Timo Schreck is an author at Aschaffenburg University of Applied Sciences specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceSinteringApplied PhysicsSurface ScienceElectrochemistryMicroelectronicsPower ElectronicsElectrical Insulation

Publications per year

2012–2024

4

Publications

4

Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

Christopher Fuchs, Timo Schreck, Michael Kaloudis · Journal of Materials Science · 2012 · 23 citations

Materials Science, Materials Engineering, Interfacial Reactions +10

Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability

Miriam Rauer, Antje Volkert, Timo Schreck et al. · Journal of Failure Analysis and Prevention · 2014 · 20 citations · Full text

Engineering, Mechanical Engineering, Snbi57ag1 Solder Joints +3

Enzymatic Self-Degradable PLA-Based Electrets

Dennis Flachs, Sergey Zhukov, Isabella Zech et al. · Journal of Polymers and the Environment · 2024 · 13 citations · Full text

Ecological comparison of soldering and sintering as die-attach technologies in power electronics

Louisa Braunwarth, Sebastian Amrhein, Timo Schreck et al. · Journal of Cleaner Production · 2015 · 12 citations

Materials Science, Electrical Engineering, Sintering +10

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