Statistics
Publications
1
Citations
12
H-Index
1
Active since
2007
Affiliations
Jones Wang is an author at Advanced Semiconductor Engineering (Taiwan) specializing in electronic packaging, materials engineering, and mechanical engineering.
Publications per year
2007–2007
1
1
Challenges of Thin Core Substrate Flip Chip Package on Advanced Si Nodes
Christine Chiu, Kuan-Yu Chang, Jones Wang et al. · 2007 · 12 citations
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