Concepedia

Roman Krumpholz

RK

2

Publications

26

Citations

2

H-Index

2019

Active since

Affiliations

Technical University of Munich(Current)

Roman Krumpholz is an author at Technical University of Munich specializing in biomedical sensors, electronic packaging, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceMicrofabricationAdvanced PackagingBiomedical DevicesBiomedical SensorsPolymer ProcessingThermal EngineeringElectronic PackagingBiomedical Engineering

Publications per year

2019–2021

2

Publications

2

Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C

Valérie Werner, Roman Krumpholz, Christoph Rehekampff et al. · Polymer Engineering and Science · 2019 · 13 citations

Engineering, High‐temperature Injection, Mechanical Engineering +21

COVID-19 and beyond: development of a comprehensive telemedical diagnostic framework

Jonas Fuchtmann, Roman Krumpholz, Maximilian Berlet et al. · International Journal of Computer Assisted Radiology and Surgery · 2021 · 13 citations · Full text

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