Concepedia
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Publications
1
Citations
28
H-Index
Active since
2017
Chi-Hai Kuo is an author specializing in packaging design, wafer-level packaging, and chip packaging.
Publications per year
2017–2017
A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package
Puru Burce Lin, Cheng-Ta Ko, Wei-Tse Ho et al. · 2017 · 28 citations
Engineering, Computer Engineering, Electrical Engineering +17
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