Xiaocun Wang

Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air

Xiaocun Wang, Zhaoqiang Zhang, Yunya Feng et al. · Journal of Materials Science Materials in Electronics · 2021 · 25 citations

Materials Science, Engineering, Metal Nanoparticles +5

Facile Transfer of a Transparent Silver Nanowire Pattern to a Soft Substrate Using Graphene Oxide as a Double-Sided Adhesion-Tuning Layer

Jianzhong Wang, Yunxia Jin, Kaiqing Wang et al. · ACS Applied Materials & Interfaces · 2023 · 15 citations

Double-sided Adhesion-tuning Layer, Engineering, Pattern Transfer +18

Rapid low temperature sintering in air of copper submicron particles with synergistic surface-activation and anti-oxidative protection

Tianke Qi, Xiaocun Wang, Jianfu Yang et al. · Journal of Materials Science Materials in Electronics · 2019 · 13 citations

Materials Science, Chemical Engineering, Synergistic Surface-activation +8

Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol

Xiaocun Wang, Shuo Han, Fei Xiao · Applied Surface Science · 2024 · 12 citations