Herbert Reichel

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Active since

2016

Affiliations

Georg Simon Ohm University of Applied Sciences Nuremberg(Current)

Herbert Reichel is an author at Georg Simon Ohm University of Applied Sciences Nuremberg specializing in adhesive bonding, semiconductor devices, and interconnect fabrication.

Publications per year

2016–2021

Publications

Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

Julian Schirmer, Marcus Reichenberger, Annette Wimmer et al. · 2021 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +13

Manufacturing of sandwich structures for the integration of electronics in in mold labelling components

Annette Wimmer, Herbert Reichel, Bernhard H. Rauch et al. · 2016 · 10 citations

Engineering, Manufacturing Engineering, Materials Engineering +17

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