Ki-Bon Cha

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Active since

2000

Affiliations

Hyundai Heavy Industries (South Korea)(Current)

Ki-Bon Cha is an author at Hyundai Heavy Industries (South Korea) specializing in packaging design, package-level reliability, and package reliability.

Publications per year

2000–2002

Publications

Copper lead frame: an ultimate solution to the reliability of BLP package

Kwang‐Seong Choi, Teck-Gyu Kang, Ik-Seong Park et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2000 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +16

Ultra-thin and crack-free bottom leaded plastic (BLP) package design

Ki-Bon Cha, Young-Gon Kim, Dae-Soon Kang · 2002 · 12 citations

Agriculture, Electrical Engineering, Electronic Materials +15

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