Concepedia

Liguang Du

LD

Statistics

Publications

2

Citations

39

H-Index

2

Active since

2000

Affiliations

South China University of Technology(Current)

Liguang Du is an author at South China University of Technology specializing in materials science, natural sciences, and soldered joints.

Publications per year

2000–2015

2

Publications

2

Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu solder joints

Shawkret Ahat, Liguang Du, Mei Sheng et al. · Journal of Electronic Materials · 2000 · 24 citations

, , +12

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

G. Q. Wei, Liguang Du, Yin-pei Jia et al. · Journal of Materials Science Materials in Electronics · 2015 · 15 citations

, , +14

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