Concepedia

Fangcheng Duan

FD

3

Publications

82

Citations

3

H-Index

2021

Active since

Affiliations

Harbin Institute of Technology(Current)

Shenzhen Institute of Information Technology

Fangcheng Duan is an author at Harbin Institute of Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

Publications per year

2021–2023

3

Publications

3

Brief Review of Nanosilver Sintering: Manufacturing and Reliability

Jintao Wang, Si Chen, Luobin Zhang et al. · Journal of Electronic Materials · 2021 · 34 citations

, , +2

Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM

Jintao Wang, Ziwen Lv, Luobin Zhang et al. · Acta Materialia · 2023 · 30 citations

, , +8

Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives

Weiwei Zhang, Jintao Wang, Hao Liu et al. · International Journal of Adhesion and Adhesives · 2022 · 18 citations

, , +7

Rows per page

1–3 of 3