T. Kim

The effects of topology upon fluid-flow and heat-transfer within cellular copper structures

Jiameng Tian, T. Kim, Tian Jian Lu et al. · International Journal of Heat and Mass Transfer · 2004 · 311 citations

Materials Science, Heat Transfer Process, Engineering +9

Convective heat dissipation with lattice-frame materials

T. Kim, Changying Zhao, T.J. Lu et al. · Mechanics of Materials · 2003 · 170 citations

Convective Heat Dissipation, Engineering, Applied Physics +6

Thermal Transport in High Porosity Cellular Metal Foams

Changying Zhao, T. Kim, Tian Jian Lu et al. · Journal of Thermophysics and Heat Transfer · 2004 · 170 citations

Copper Foams, Engineering, Mechanical Engineering +17

Fluid-flow and endwall heat-transfer characteristics of an ultralight lattice-frame material

T. Kim, H. P. Hodson, Tian Jian Lu · International Journal of Heat and Mass Transfer · 2003 · 168 citations

Materials Science, Radiative Heat Transfer, Heat Transfer Process +9

An Analytical Unit Cell Model for the Effective Thermal Conductivity of High Porosity Open-Cell Metal Foams

Xiaohu Yang, Jia Xi Bai, Hongbin Yan et al. · Transport in Porous Media · 2014 · 163 citations

Materials Science, Thermal Insulation, Foam +10