Concepedia

Martin Anselm

MA

6

Publications

184

Citations

6

H-Index

2013

Active since

Affiliations

Binghamton University(Current)

Universal Instruments (United States)

Rochester Institute of Technology

Martin Anselm is an author at Binghamton University specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsReliability EngineeringFailure AnalysisMaterial ScienceMechanicsReliabilityMicrostructure

Publications per year

2013–2018

6

Publications

6

Solder joint reliability under realistic service conditions

Sa’d Hamasha, Mazin Obaidat, Venkatesh Arasanipalai Raghavan et al. · Microelectronics Reliability · 2013 · 45 citations

Reliability, Reliability Engineering, Engineering +7

Reliability and failure mechanism of solder joints in thermal cycling tests

Babak Arfaei, Sam Mahin-Shirazi, Shantanu Joshi et al. · 2013 · 42 citations

Engineering, Joint Failure, Mechanical Engineering +28

Effects of varying amplitudes on the fatigue life of lead free solder joints

Mazin Obaidat, Sa’d Hamasha, Younis Jaradat et al. · 2013 · 30 citations

Materials Science, Fatigue Life, Engineering +15

Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking

Quang T. Su, James M. Pitarresi, Mohammad A. Gharaibeh et al. · 2014 · 27 citations

Engineering, Mechanical Engineering, Vibration Measurement +23

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart et al. · Journal of Electronic Packaging · 2018 · 24 citations

Engineering, Mechanical Engineering, Vibration Analysis +21

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