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Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

Materials ScienceNi/sn-2.5ag/ni MicrobumpsNanoscale SystemIntermetallic CompoundsEngineeringPhysicsNanotechnologyNanoelectronicsApplied PhysicsIntegrated CircuitsNanoscale ScienceMicroelectronicsThree-dimensional Integrated CircuitsInterconnect (Integrated Circuits)