Multi-layered solid-PCM thermocline thermal storage for CSP. Numerical evaluation of its application in a 50MWe plant - Concepedia

Concepedia

Publication | Open Access

Multi-layered solid-PCM thermocline thermal storage for CSP. Numerical evaluation of its application in a 50MWe plant

DOI Full Paper Access

62

Citations

26

References

2015

Year

Pedro Galione, Carlos David Pérez Segarra, I. Rodríguez, Santiago Torras, Joaquim Rigola

Materials SciencePhase-change MaterialEngineeringNumerical EvaluationThermal ManagementThermal AnalysisThermal ModelingThermodynamicsElectronic PackagingHeat TransferThermal Energy StorageThermal Engineering

References

	Year	Citations

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