Concepedia
Journal of Materials Science · 2000 · 143 citations · 1 references
Natural SciencesMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMold MakingEpoxy ResinsFiller Distribution EffectsFiller Particle Size EffectsFiller Shape EffectsMold Filling
1
Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
Wonho Kim, Jong‐Woo Bae, Ildong Choi et al. · Polymer Engineering and Science · 1999 · 94 citations
Natural Sciences, Materials Engineering, Materials Science +14