Journal of Materials Science Letters · 2003 · 14 citations · 8 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMicroelectromechanical SystemsSemiconductor DevicesAdhesive BondingCoatingsPressure SensorsThin Film AdhesionWafer BondingAdhesive PropertiesAdhesive TechnologyAdhesivesPressure-sensitive AdhesivesPressure-sensitive Materials
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