Printed circuit board materials handbook

Abstract

Continuous Glass Fiber Reinforcement for Printed Wiring Board Application.Glass Reinforcement.Films, Polymide.Polyethylene Teraphthalate (PET) and Polyethylene Naphthalate (PEN) for Printed Circuit Application.Punching Grades of Copper Clad Laminates.Resins.Copper Foils.Anodes for Printed Wiring Plating.Prepreg and Laminates.Non-Woven Aramid Reinforcement.Drill Bits and Routers.Fabrication of Rigid Printed Wiring Boards.Fabrication of Flexible and Rigid Flexible Printed Wiring Boards.Photoresist.Etching Inner Layers.Oxide Coatings.Lamination of Rigid Multilayer Boards.Lamination of Flex and Rigid Flex Printed Wiring Boards.Entry and Back-Up Material.Drilling Rigid and Flexible Printed Wiring Boards.Desmear/Etchback Process.Plasma Etchback.Electroless Copper Process.Direct Metalization Process.Electroplating.Additive Copper.Etching Outer Layers.Photoimageable Soldermask.Screenable Solder Mask Coatings.Hot Air Leveling.Microsection Anaysis.Electrical Test.