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Mesoporous hollow silica with controlled particle size for optimizing dielectric properties and coefficient of thermal expansion of polyimide packaging materials

Materials EngineeringMaterials ScienceEngineeringNanoporous MaterialPolymer ScienceApplied PhysicsMesoporous Hollow SilicaPorous PolymerPolyimide Packaging MaterialsNanocompositeSol-gel SynthesisThermal Expansion