Recent advances in polymer-based composites for thermal management and electromagnetic wave absorption

Abstract

With the rapid development of electronic technology and the integration of electronic chips, electromagnetic wave pollution and thermal management have become two critical issues hindering the growth of electronic equipment. Traditional polymer-based electronic packaging materials have very low thermal conductivity and almost no electromagnetic wave absorption ability. Therefore, the development of polymer-based composites with efficient electromagnetic wave absorption and thermally conductive performances is currently a hot research topic in the field of microelectronic packaging. At present, the addition of thermally conductive and dielectric (magnetic) fillers to the polymer matrix is an effective way to solve this problem. In this review, firstly, we briefly introduce the mechanism of action of electromagnetic wave absorbing materials and thermally conductive materials, respectively. Then, we list the relevant representative fillers which can be used in electromagnetic wave absorption and thermal management and summarize the current research progress of these materials. Finally, we present the current challenges facing the field and prospects for future development. In this review, we give a detailed overview of the research progress on the microwave absorption and thermally conductive properties of the composites with different fillers and microstructures.