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Achieving excellent thermal transport in diamond/Cu composites by breaking bonding strength-heat transfer trade-off dilemma at the interface

Materials ScienceMaterials EngineeringDiamond-like CarbonEngineeringThermal TransportApplied PhysicsDiamond/cu CompositesThermodynamicsThermal ConductionElectronic PackagingHeat TransferExcellent Thermal TransportThermal EngineeringThermal ConductivityThermal Property