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Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer

Materials ScienceInterface DelaminationWafer Scale ProcessingWafer CrackingEngineeringMechanical EngineeringApplied PhysicsElectronic PackagingMicroelectronicsSurface ProcessingMechanics Of MaterialsThin Film ProcessingUltra-thin Wafer