AMD Instinct™ MI300X Accelerator: Packaging and Architecture Co-Optimization

Abstract

The AMD Instinct™ MI300X accelerator utilizes multiple advanced packaging technologies for a heterogeneous integration solution for emerging AI/ML and HPC workloads. These include microbump 3D memory stacks, 2.5D silicon interposers, and 3D hybrid bonding. The combination of these advanced packaging technologies enabled architectural innovations and generational performance uplifts that cannot be achieved with traditional technologies and Moore's Law scaling A modular 3D chiplet design also enables reuse of the MI300X components to enable the MI300A APU.