Publication | Closed Access

Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN

Materials ScienceMaterials EngineeringThermal CyclicEngineeringSevere Plastic DeformationMechanical EngineeringMaterial ModelingMicrostructure-strength RelationshipHigh-performance MaterialElectronic PackagingTsv-cu Structure DeformationThermomechanical AnalysisMechanics Of Materials