Codesign of quantum error-correcting codes and modular chiplets in the presence of defects

Abstract

Fabrication errors pose a significant challenge in scaling up solid-state quantum devices to the sizes required for fault-tolerant (FT) quantum applications. To mitigate the resource overhead caused by fabrication errors, we combine two approaches: (1) leveraging the flexibility of a modular architecture, (2) adapting the procedure of quantum error correction (QEC) to account for fabrication defects.