Leveraging the Cu<sub>2</sub>SnTe<sub>3</sub> additive for an improved thermoelectric figure of merit and module efficiency in Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub>-based composites

Qiaoyan Pan, Kaikai Pang, Qiang Zhang, Yan Liu, Huilie Shi, Jingsong Li, Wenjie Zhou, Qianqian Sun, Yuyou Zhang, Xiaojian Tan,

Journal of Materials Chemistry A · 2024 · 15 citations · 51 references

Concepts

Abstract

The highly active additive Cu 2 SnTe 3 generates multi-scale defects, effectively reducing lattice thermal conductivity. Along with optimized weighted mobility, the higher quality factor yields a competitive ZT value in the (Bi,Sb) 2 Te 3 -based composite.

References

51