1c:I[419806,["/_next/static/chunks/bb923814e1f4d2e9.js","/_next/static/chunks/dd3ee9f5b7716ca6.js","/_next/static/chunks/4204a0ae82542ca8.js","/_next/static/chunks/1270dead247da766.js","/_next/static/chunks/6e1aa89a642f40be.js","/_next/static/chunks/2d7aa753e81324a8.js","/_next/static/chunks/8ffd0b71567920d8.js","/_next/static/chunks/67ea6dfd21f16c5f.js","/_next/static/chunks/24eb4379f68013fd.js","/_next/static/chunks/b8cd775ffdf935bd.js","/_next/static/chunks/983103cd9eb7b428.js","/_next/static/chunks/263f2cdcb9aa2341.js","/_next/static/chunks/294b9525248c8e5f.js"],"default"] 1d:T44e,The rapid development of faster, cheaper, and more powerful computing has led to some of the most important technological and societal advances in modern history. However, the physical means associated with enhancing computing capabilities at the device and die levels have also created a very challenging set of circumstances for keeping electronic devices cool, a critical factor in determining their speed, efficiency, and reliability. With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials to help address some of these pressing thermal management challenges. In this paper a number of cubic crystals, two-dimensional layered materials, nanostructure networks and composites, molecular layers and surface functionalization, and aligned polymer structures are examined for potential applications as heat spreading layers and substrates, thermal interface materials, and underfill materials in future-generation electronics.1e:T457,Wireless charging is a technology of transmitting power through an air gap to electrical devices for the purpose of energy replenishment. The recent progress in wireless charging techniques and development of commercial products have provided a promising alternative way to address the energy bottleneck of conventionally portable battery-powered devices. However, the incorporation of wireless charging into the existing wireless communication systems also brings along a series of challenging issues with regard to implementation, scheduling, and power management. In this paper, we present a comprehensive overview of wireless charging techniques, the developments in technical standards, and their recent advances in network applications. In particular, with regard to network applications, we review the static charger scheduling strategies, mobile charger dispatch strategies and wireless charger deployment strategies. Additionally, we discuss open issues and challenges in implementing wireless charging technologies. Finally, we envision some practical future network applications of wireless charging.1f:T40a,Thermoelectric materials have a large Peltier effect, making them attractive for solid-state cooling applications. Bismuth telluride (Bi₂Te₃)-based alloys have remained the state-of-the-art room-temperature materials for many decades. However, cost partially limited wider use of thermoelectric cooling devices because of the large amounts of expensive tellurium required. We report n-type magnesium bismuthide (Mg₃Bi₂)-based materials with a peak figure of merit (ZT) of ~0.9 at 350 kelvin, which is comparable to the commercial bismuth telluride selenide (Bi₂Te_3- _x Se _x ) but much cheaper. A cooling device made of our material and p-type bismuth antimony telluride (Bi_0.5Sb_1.5Te₃) has produced a large temperature difference of ~91 kelvin at the hot-side temperature of 350 kelvin. n-type Mg₃Bi₂-based materials are promising for thermoelectric cooling applications.

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