Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis - Concepedia

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Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis

13

Citations

25

References

2024

Year

Nitin Gupta, Arunjunai Raj Mahendran, Stephanie Weiss, Mohammed Khalifa

Journal of Thermal Analysis and Calorimetry

Materials ScienceEngineeringPolymer ScienceLight CuringDielectric AnalysisThermal AnalysisHeat TransferThermoplastic CompositeThermal EngineeringPolymer ChemistryThermal InsulationThermoanalytical Method

References

	Year	Citations

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